| |
Item |
English System (Metric System) |
| 1 |
NO. LAYER |
2-24 (Batch Process)
2-24 (Sample Board) |
| 2 |
FINISHED BOARD SIZE (MAX) |
23inch X 41inch
(584.2mm X 1041.4mm) |
| 3 |
FINISHED BOARD SIZE (MIN) |
1inch X 1.2inch
(25.4mm X 30.48mm) |
| 4 |
BOARD THICKNESS (MAX) |
0.236inch (6.0mm) |
| 5 |
BOARD THICKNESS (MIN) |
0.016inch (0.40mm) |
| 6 |
T/C THICKNESS |
0.0039inch (0.10mm) |
| 7 |
FINISHED BOARD THICKNESS TOLERANCE
(BOARD THICKNESS ≧0.8mm) |
+/-10% |
| 8 |
FINISHED BOARD THICKNESS TOLERANCE
(0.4mm≦BOARD THICKNESS<0.8mm) |
+/-3mils(+/-0.075 mm) |
| 9 |
WARPAGE (MAX) |
0.5% |
| 10 |
DRILLED HOLE DIAMETER (MAX) |
6.70mm |
| 11 |
DRILLED HOLE DIAMETER (MIN) |
0.1mm |
| 12 |
FINISHED HOLE DIAMETER (MIN) |
0.075mm |
| 13 |
OUTER LAYERBASE COPPER THICKNESS (MIN) |
1/3 oz (0.012mm) |
| 14 |
OUTER LAYERBASE COPPER THICKNESS (MAX) |
6
oz (0.21mm) |
| 15 |
INNER LAYER BASE COPPER THICKNESS (MIN) |
0.5 oz (0.017mm) |
| 16 |
INNER LAYER BASE COPPER THICKNESS (MAX) |
6
oz (0.21mm) |
| 17 |
INNER LAYER DIELECTRIC THICKNESS (MIN) |
0.0039inch (0.10mm) |
| 18 |
DIELECTRIC MATERIAL (MIN) |
CEM-3 FR4(130℃ Tg)
Rogcrs4003 FR4(140℃ Tg)
FR4(150-170℃ Tg) |
| 19 |
HOLE PLATING ASPECT RATIO (MAX) |
8:01:00 |
| 20 |
HOLE DIAMETER TOLERANCE (PTH) |
+/-3mils(Batch Process) |
| 21 |
HOLE DIAMETER TOLERANCE (NPTH) |
+/-2mils(Batch Process)
+/-1mils(Special Requirement) |
| 22 |
OUTER LAYER LINE WIDTH/SPACING (MIN) |
T/T oz is 4mil/4mil(T 1/3 oz)
H/H oz is 4mil/5mil
1/1 oz is 6mil/6mil
2/2 oz is 7mil/7mil
2/2 oz is 7mil/7mil |
| 23 |
INTER LAYER WIDTH/SPACING (MIN) |
H/H oz is 4mil/4mil
1/1 oz is 4mil/4mil
2/2 oz is 6mil/6mil
3/3 oz is 6mil/6mil |
| 24 |
SOLDERMASK THICKNESS (MIN) |
10 um |
| 25 |
SOLDERMASK DAM (MIN) |
3mil (0.076mm) (C7)
2.5mil(0.0635mm)(k-3ID 780 5600) |
| 26 |
SOLDERMASK PLUG HOLD DIAMETER |
≧0.75mm Hole Soft Soldering
0.55mm-0.75mm Single-face Tin Bead
≦0.55mm No Tin Bead |
| 27 |
IMPEDANCE TOLERANCE (MIN) |
+/-10% |
|
28 |
Surface Processing |
1. Hot Air Leaving
2. Immersion Gold
3. Deposited Nickel/Gold
4. OSP |
| 29 |
THERMAL STRESS TEST |
288℃ 10 sec
One Shot |
| 30 |
FLAMMABILITY |
94V-0 |
| 31 |
IONIC CONTAMINATION |
≦10ug/in2
(≦1.55ug/mm2) |
